ELECTRONIC MATERIALS & COMPONENTS for Online Examination K Scheme (II - E&Tc/ECE/ELEX. - 312316)

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Syllabus Electronic Materials & Components - (312316) Learning Scheme Credits Assessment Scheme Actual Contact Hrs./Week SLH NLH Paper Duration Theory Based on LL & TL Based on SL Total Marks CL TL LL Practical FA-TH SA-TH Total FA-PR SA-PR SLA Max Max Max Min Max Min Max Min Max Min 3 - 2 1 6 3 1.5 30 70 100 40 25 10 - - 25 10 150 Sr. No. Theory Learning Outcomes (TLO's) aligned to CO's. Learning content mapped with Theory Learning Outcomes (TLO's) and CO's. 1. TLO 1.1 Explain the effect of the given factor on the resistivity of electrical material. TLO 1.2 Describe the characteristics of the given semiconductor material. TLO 1.3 Describe the properties of the given Photo emissive material. TLO 1.4 Explain the phenomenon of dielectric material. TLO 1.5 Select the dielectric material for the given application. TLO 1.6 Classify the magnetic material on the basis of given magnetic properties Unit - I Electronic Materials 1.1 Factors affecting the resistivity of material like temperature, area of cross-section, length (or distance) of the element. 1.2 Semiconductor materials: Intrinsic, extrinsic, charge carriers, P type and N Type, applications 1.3 Photo emissive materials: Properties, applications 1.4 Dielectric Materials: Types, Properties, Effect of frequency on performance of dielectric materials 1.5 Magnetic Materials: Properties, classification : Permanent magnetic dipole, diamagnetism, paramagnetism, ferromagnetism. 1.6 Soldering materials: Alloys and fluxes. (Chapter - 1) 2. TLO 2.1 Describe the property of passive component for the given parameter. TLO 2.2 Classify the active components TLO 2.3 Suggest the relevant combination of materials for the LED of the given color TLO 2.4 Describe the given type of IC and its package. TLO 2.5 Differentiate between the given types of ICs. TLO 2.6 Identify the relevant micro devices for the given application/s Unit - II Electronic Components 2.1 Passive Components: Concepts of Resistance, Capacitance , Inductance. Specifications, type and applications Voltage Dependent Resistor (VDR),Temperature Dependent Resistor (TDR), Light Dependent Resistor (LDR). 2.2 Electronic Materials and doping level for PN junction diode, Zener diode, LEDs, PNP and NPN transistor. 2.3 Construction, working principle and applications of OLED 2.4 Integrated Circuit: Introduction to Monolithic IC, thick & thin film IC, Hybrid IC, Linear IC, Digital IC and IC packages (SIP, TO5, Flat, DIP), Pin , Device Identification, Temperature ranges. 2.5 Types and applications of micro electronic components : Micro motors, Micro relay, Microswitches. (Chapter - 2)   3. TLO 3.1 Explain SMT and SMD. TLO 3.2 Describe the steps involved in the assembly technique in the SMT. TLO 3.3 Differentiate between the given type of the soldering / desoldering in SMT. TLO 3.4 Identify the need of SMT with respect to its advantages. TLO 3.5 Classify the SMD packages with respect to the given type of components. Unit - III Surface Mount Devices 3.1 Introduction to Surface Mount Technology (SMT) and Surface mount Devices (SMD). 3.2 Assembly and rework techniques: Contact and noncontact types of soldering and de-soldering 3.3 Advantages and Disadvantages of SMT 3.4 SMD packages : Two terminal package for passive and active components, Three or four terminal packages, five or six terminal packages, More than six terminal packages; Examples of each 3.5 Automatic component insertion technique (Chapter - 3) 4. TLO 4.1 Describe the constructional features of the given type of PCB. TLO 4.2 Compare the constructional features of the given type of PCB. TLO 4.3 Identify the types of the PCB with respect to applications. TLO 4.4 Describe the given method of PCB printing. TLO 4.5 Describe Electronic Waste Management. Unit - IV Printed Circuit Board 4.1 Introduction to PCB, Advantages, disadvantages of PCB, Types of PCB and applications 4.2 Constructional features of PCB 4.3 Flexible PCB, Multilayer PCB, plated through hole (PTH) 4.4 Screen printing, photo-printing methods 4.5 Soldering Techniques: Dip, wave. reflow 4.6 PCB testing 4.7 Need of Electronic waste management , E-Waste Recycling. (Chapter - 4) 5. TLO 5.1 State the basic principle of Photovoltaic Cell for the given application. TLO 5.2 Illustrate construction of solar panel. TLO 5.3 List the different types of solar energy storage system for the given specifications TLO 5.4 Explain use of battery bank for solar power system. TLO 5.5 Choose the suitable battery for a solar energy system. Unit - V Solar system components 5.1 Photovoltaic materials, properties and applications. 5.2 Solar Cell: Working Principle and Construction 5.3 Materials used in a Solar Panel 5.4 Energy storage system used in solar panel, its ratings and selection factors. 5.5 Terminologies used in energy storage system like capacity, power ratings, depth of discharge (DoD),round-trip efficiency, warranty and life span (Chapter - 5)

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Pages: 112 Edition: 2024 Vendors: Technical Publications